High Performance Computing (HPC) and Artificial Intelligence (AI) workloads place extreme demands on the physical infrastructure that supports them.
Oper8 supplies and integrates infrastructure designed for modern HPC and AI environments, including liquid cooling solutions, high‑density racks and power distribution engineered for reliable and scalable operation.
These HPC & AI products can be delivered as standalone components or integrated into wider solutions, with Oper8 providing design support, installation, commissioning and maintenance to ensure ongoing performance.
Rear Door Heat Exchangers (RDHx) provide a practical way to increase rack densities for HPC & AI deployments without requiring fundamental changes to the wider data centre cooling system.
Direct‑to‑Chip liquid cooling (D2C) removes heat directly from CPUs and GPUs using cold plates connected via a closed liquid cooling loop to a coolant distribution unit.
Coolant Distribution Units (CDUs) manage the delivery and control of liquid coolant within direct‑to‑chip (D2C) cooling architectures.
Oper8 supplies and integrates racks designed specifically for high‑density compute, with consideration given to structural loading.
Oper8 supplies and integrates intelligent rack PDUs suitable for high‑density compute, supporting high current ratings and detailed billing-grade power monitoring.
Rear Door Heat Exchangers (RDHx) provide a practical way to increase rack densities for HPC & AI deployments without requiring fundamental changes to the wider data centre cooling system. By removing heat directly at the rear of the rack, RDHx solutions significantly reduce heat rejection into the room while maintaining conventional server airflow patterns.
Oper8 designs and integrates RDHx solutions as part of a wider infrastructure approach, considering available space, rack depth, airflow management, water connection and long‑term serviceability. This ensures deployments remain reliable, maintainable and aligned with future density growth.
RDHx solutions offer a cost‑effective alternative to large‑scale facility upgrades, enabling higher‑density deployments in existing data centres where power capacity is available but room cooling headroom is limited. They also play an important role in new medium‑density and hybrid air and liquid cooled environments.
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Direct-To-Chip Liquid Cooling (D2C) removes heat directly from CPUs and GPUs using cold plates connected via a closed liquid cooling loop to a Coolant Distribution Unit (CDU) or Heat Rejection Unit (HRU) enabling substantially higher compute densities and more stable thermal performance than air only approaches.
Oper8 supplies and integrates both single phase and two phase D2C solutions, engineered as part of a hybrid cooling architecture. In practical deployments, liquid cooling can remove the majority of the heat load, with air cooling still required to manage residual heat generated by non liquid cooled components within the rack such as storage devices and network switches.
D2C solutions are typically deployed in environments with high‑density CPU and GPU workloads where conventional air cooling cannot scale effectively. Oper8 delivers these systems as fully engineered infrastructure components, with careful consideration given to rack layout, coolant distribution and power integration.
Coolant Distribution Units (CDUs) or Heat Rejection Units (HRUs) manage the delivery and control of liquid coolant within direct‑to‑chip (D2C) cooling architectures, forming the interface between liquid‑cooled IT equipment and the wider heat‑rejection system.
Here at Oper8, we supply and integrate in‑rack or in‑row CDUs depending on deployment scale and the specific D2C approach being used. In‑rack CDUs are typically deployed to support one or two high‑density racks, including extremely high‑density compute deployments, while in‑row or end‑of‑row CDUs are used for larger installations where coolant needs to be distributed across multiple racks and higher aggregate loads.
In practice, CDU selection comes down to how many racks are being supported, how much heat is being removed and where that heat can be rejected. Oper8 works through these constraints early to ensure the chosen CDU arrangement fits the space available and leaves a sensible path for expansion if requirements grow.
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Designed in-house and built for performance, efficiency and future growth, our data centres are engineered to adapt as your business grows.
We have an ethos of excellence in customer support and make it our mission to ensure your needs are met at every stage of the process. From our security-first design with built-in compliance and protection, to the custom integrations and solutions unique to you, Oper8 offers an unparalleled data centre experience.
Racks supporting HPC & AI workloads must accommodate heavier weights, deeper servers, deeper storage devices, higher power densities and the integration of liquid cooling components. These deployments also require space for multiple rack PDUs, along with D2C manifolds or RDHx mounting hardware, meaning standard enterprise racks are often not suitable.
Oper8 supplies and integrates racks designed specifically for high density compute, with consideration given to structural loading, rack depth, airflow management and compatibility with liquid cooled architectures. These racks are specified to support the practical realities of modern CPU and GPU dense platforms and form part of Oper8’s wider racks & physical infrastructure product offering. We offer 1500, 1600 and 1800mm deep racks to future-proof your compute.
In‑rack power distribution is a critical consideration in HPC & AI environments, where higher rack densities place far greater demands on power delivery than standard enterprise deployments.
Oper8 supplies and integrates intelligent rack PDUs suitable for high‑density compute, supporting high current ratings and detailed billing-grade power monitoring, specified to align with the overall power architecture and physical constraints within the rack.
Rack power distribution for HPC & AI forms part of Oper8’s wider power & electrical systems product offering.
